K4B2G0846F-BMMA

The K4B2G0846F-BMMA is Samsung’s 2 Gb DDR3L SDRAM component (F-die), organised 256Mx8 with 8 banks in a 78-ball FBGA package. It is one of the four orderable codes the §1 ordering table of this datasheet prints: two temperature letters by two speed bins.

Key figures

• Density and organisation: the ordering table prints 256Mx8 for this code and §2 prints “The 2Gb DDR3 SDRAM F-die is organized as a 32Mbit x 8 I/Os x 8 banks device”; the cover line prints 2Gb F-die DDR3L SDRAM. Our arithmetic: 32 Mbit x 8 I/O = 256 Mb per bank x 8 banks = 2 Gb.
• Speed bin: this code sits in the table column DDR3L-1866(13-13-13) (CL-tRCD-tRP 13-13-13; §2 Table 2 prints tCK(min) 1.071 ns for that bin).
• Temperature: the table’s note 2 prints the 13th digit mapping for this code as “M” : Industrial temp, and §6.2 Table 5 prints Industrial -40 to 95 (deg C) as the component operating range (site term: -40~95°C).
• Supplies: §2 prints “JEDEC standard 1.35V(1.28V~1.45V) & 1.5V(1.425V~1.575V)” for VDD and VDDQ.
• Package: the ordering table prints 78 FBGA and §2 prints “Package : 78 balls FBGA – x8”.
• Absolute maximum ratings (§6.1): the table prints T Storage Temperature -55 to +100 (deg C).

Backward compatibility

Note 3 of the ordering table is attached to this code’s speed column and prints, verbatim including its own typo: “Backward compatible to DDRL3-1600(11-11-11), DDR3L-1333(9-9-9)”. We reproduce the string as printed rather than silently correcting DDRL3 to DDR3L.

Document status: Preliminary

This datasheet is a Preliminary release, not a Final one: its revision history carries a single row printing “0.5 – Preliminary SPEC release 26th Oct. 2015 – J.Y.Lee” and every page footer prints Preliminary Rev. 0.5. We publish the figures as printed in that document and state its status rather than presenting it as a finished specification. No later revision of this datasheet is in our hands; if a Final version is obtained the pages will be re-verified against it. Tracked as N269.

Lifecycle status

The Lifecycle row above is left blank: the datasheet is a technical specification and prints no product status. Separately, we have not verified a reachable per-code Samsung product page for this order code, and third-party catalogue or distributor listings are not an acceptable on-page source under this site’s rules. So this page makes no Active or End-of-Life claim; the gap is tracked as N269.

What this document says about grade

The Industrial word above is a temperature range the document assigns to the 13th digit; it is not a reliability qualification. The datasheet carries no certification standard, no qualification body, and no qualification result anywhere in its 72 pages, so this page publishes only the printed operating range and asserts no grade beyond it.

Provenance

Every figure above is taken from Samsung 2Gb DDR3L F-die DDR3 SDRAM component datasheet **Preliminary Rev. 0.5** (72 pages · md5 f4b91dfdceb4e8ac7afb5d157856c73c · last row of the revision-history table 0.5 – Preliminary SPEC release 26th Oct. 2015 – J.Y.Lee), a channel-local copy. Its PDF /Info carries no aggregator watermark and its revision history is part-number-level, but no byte-identical manufacturer-hosted public copy has been verified, so the manufacturer datasheet button is left unpopulated and we do not host the file.

Who makes it

K4B2G0846F-BMMA is a DDR3L SDRAM component of Samsung Electronics Co., Ltd.