K4B2G1646F-BCNB

The K4B2G1646F-BCNB is Samsung’s 2 Gb DDR3 SDRAM component (F-die), organised 128Mx16 with 8 banks in a 96-ball FBGA package. It is one of the three orderable codes the §1 ordering table of this datasheet prints – one 128Mx16 row across three speed bins, all three carrying the same temperature letter.

Key figures

• Density and organisation: the ordering table prints 128Mx16 for this code and §2 prints “The 2Gb DDR3 SDRAM F-die is organized as a 16Mbit x 16 I/Os x 8 banks device”; the cover line prints 2Gb F-die DDR3 SDRAM. Our arithmetic: 16 Mbit x 16 I/O = 256 Mb per bank x 8 banks = 2 Gb.
• Speed bin: this code sits in the table column DDR3-2133(14-14-14) (CL-tRCD-tRP 14-14-14; §2 Table 2 prints tCK(min) 0.938 ns for that bin, and §2 lists the matching clock as 1066MHz for 1600Mb/sec/pin).
• Temperature: the ordering table’s note 2 prints the 13th digit of this code as “C” : Comercial temp/Normal power – reproduced exactly as printed, including the manufacturer’s own spelling – and §6.2 Table 5 prints a single operating row, 0 to 95 (deg C) (site term: 0~95°C). This document gives no second temperature letter, unlike the 2Gb x8 F-die datasheet of the same family.
• Supplies: §2 prints “JEDEC standard 1.5V ± 0.075V Power Supply” and §7.1 Table 6 gives VDD and VDDQ as 1.425 / 1.5 / 1.575 V (min / typ / max).
• Package: the ordering table prints 96 FBGA and §2 prints “Package : 96 balls FBGA – x16”.
• Absolute maximum ratings (§6.1): the table prints T Storage Temperature -55 to +100 (deg C).

How the document layers its temperature figures

§6.2 prints one operating row in Table 5 (0 to 95 deg C) and then adds two notes we quote rather than merge: note 2 says the case temperature “must be main­tained between 0-85 (deg C) under all operating conditions”, and note 3 says some applications need the Extended Temperature Range between 85 and 95 deg C, where full specifications still apply but “Refresh commands must be doubled in frequency, therefore reducing the refresh interval tREFI to 3.9us”. So the 95 ceiling and the 85 maintenance guidance are two layers of the same table, not two competing ranges; we publish the table row as the component range and leave the notes quoted in place instead of restating them as a single number.

Document status: Final first release

This datasheet is the manufacturer’s Final release of this document: its revision history carries a single row printing “1.0 – First SPEC release 15th Jan. 2016 – J.Y.Lee” and the cover and page footers print Rev. 1.0, Jan. 2016. It supersedes the Preliminary Rev. 0.5 copy of the same document, which was the source of these pages until 2026-11-05; each figure carried over from that copy was re-checked against this revision one by one and every one of them is printed in it, so no number on this page changed with the swap – only the status wording did. The earlier copy is retained in our component library as the verification trail, and the swap itself is tracked as N269.

Lifecycle status

The Lifecycle row above is left blank: the datasheet is a technical specification and prints no product status. Separately, we have not verified a reachable per-code Samsung product page for this order code, and third-party catalogue or distributor listings are not an acceptable on-page source under this site’s rules. So this page makes no Active or End-of-Life claim; the gap is tracked as N269.

What the temperature letter does and does not claim

The Comercial / Normal power letter above is a temperature range the document assigns to the 13th digit; it is not a reliability qualification. The datasheet carries no certification standard, no qualification body and no qualification result anywhere in its 67 pages, so this page publishes only the printed operating range and asserts no grade beyond it.

Provenance

Every figure above is taken from Samsung 2Gb DDR3 F-die x16 SDRAM component datasheet **Rev. 1.0 (Final)** (67 pages · md5 b085cf6e7e2630d7c3860652e0e4b61e · last row of the revision-history table 1.0 – First SPEC release 15th Jan. 2016 – J.Y.Lee · supersedes the Rev. 0.5 preliminary revision that served as the source for these three pages; string-level re-verification in our internal verification archive), a channel-local copy. Its PDF /Info carries no aggregator watermark and its revision history is part-number-level, but no byte-identical manufacturer-hosted public copy has been verified, so the manufacturer datasheet button is left unpopulated and we do not host the file.

Who makes it

K4B2G1646F-BCNB is a DDR3 SDRAM component of Samsung Electronics Co., Ltd. The other order codes in this datasheet’s single 128Mx16 row differ from it only in speed bin, and each has its own page.