K4RAH165VB-BCQK

The K4RAH165VB-BCQK is Samsung’s 16 Gb DDR5 SDRAM component (B-die), organised 1Gx16 with 16 banks in four bank groups in a 106-ball FBGA package. It is one of the two orderable codes that the §1 ordering table of this datasheet prints – one 1Gx16 row across two speed bins.

Key figures

• Density and organisation: the ordering table prints 1Gx16 for this code and §2 prints “The 16Gb DDR5 SDRAM B-die is organized as a 64Mbit x16 I/Os x 16banks”. Our arithmetic: 64 Mbit x 16 I/O = 1 Gb per bank x 16 banks = 16 Gb.
• Speed bin: this code sits in the table column DDR5-4800(40-39-39) (CL-tRCD-tRP; §2 Table 2 prints tCK(min) 0.416 ns for that bin and the matching clock 2400MHz).
• Supply: §2 prints “VDD = VDDQ = 1.1V” and “1.1V (1.067V~1.166V) and 1.8V (1.746V~1.908V)” for the core/IO and the external activating supply – this is a 1.1V DDR5 component, not a DDR3/DDR3L part.
• Temperature: §6.3 Table 7 prints two rows – Normal Operating Temperature 0 to 85 (NT) and Extended Operating Temperature 0 to 95 (XT) – so the rated operating ceiling is 95 deg C (site term: 0~95°C). Neither order code carries a temperature letter, so both share this range.
• Package: the ordering table prints 106 FBGA and §2 prints “Package : x16-16Banks(4 Bank Groups)”.

How the document layers its temperature figures

§6.3 Table 7 splits the operating range into a Normal row (0 to 85 deg C, symbol NT) and an Extended row (0 to 95 deg C, symbol XT); the acronyms are referred to JESD402-1. We publish the 95 deg C ceiling as the component range and keep both rows quoted rather than collapsing them into a single number. The document also notes the extended-range figure is derated for stacked-die (3DS) packages, which is a separate condition we are not asserting for this monolithic component page.

Document status

This datasheet is a released specification: its cover prints “Rev. 1.9, Nov. 2023” and the footer prints Rev. 1.9. We publish the figures as printed in that document. An earlier Rev. 1.7 of the same datasheet is kept in the library but is not the source for these pages.

Lifecycle status

The Lifecycle row above is left blank: the datasheet is a technical specification and prints no product status. Separately, we have not verified a reachable per-code Samsung product page for this order code, and third-party catalogue or distributor listings are not an acceptable on-page source under this site’s rules. So this page makes no Active or End-of-Life claim; the gap is tracked as N269.

What the temperature range does and does not claim

The 0 to 95 deg C figure above is a temperature range the document assigns to the part; it is not a reliability qualification. The datasheet carries no certification standard, no qualification body and no qualification result anywhere in its 82 pages, so this page publishes only the printed operating range and asserts no grade beyond it.

Provenance

Every figure above is taken from Samsung 16Gb DDR5 B-die x16 SDRAM component datasheet **Rev. 1.9, Nov. 2023** (82 pages · md5 5b3d3bf3ed2efb6e3c4b50fbefbfbc2a · page footer Rev. 1.9), a channel-local copy. Its PDF /Info carries no aggregator watermark and its revision history is part-number-level, but it is a CONFIDENTIAL-marked manufacturer document with no byte-identical public copy verified, so the manufacturer datasheet button is left unpopulated and we do not host the file.

Who makes it

K4RAH165VB-BCQK is a DDR5 SDRAM component of Samsung Electronics Co., Ltd. The other order code in this datasheet’s single 1Gx16 row differs from it only in speed bin, and has its own page.