K4RAH046VB-BCQK

The K4RAH046VB-BCQK is Samsung’s 16 Gb DDR5 SDRAM component (B-die) in the 4Gx4 organisation, x4 width, packed in an 82-ball FBGA. It is one of the two orderable codes that the §1 ordering table of this datasheet prints – two devices of the same 16 Gb density and speed that differ in data width.

Key figures

• Density and organisation: the ordering table prints 4Gx4 for this code, and §2 describes the B-die as “The 16Gb DDR5 SDRAM B-die is organized as a 128Mbit x 4 I/Os… 32banks… device”. Our arithmetic: 128 Mbit x 4 I/O = 512 Mb per bank x 32 banks = 16 Gb.
• Speed: the ordering table lists this code under the single offered column DDR5-4800(40-39-39) (CL-tRCD-tRP; §2 Table 2 prints tCK(min) 0.416 ns for the 4800 bin and the matching clock 2400MHz).
• Supply: §2 prints “VDD = VDDQ = 1.1V” and “1.1V (1.067V~1.166V) and 1.8V (1.746V~1.908V)” for the core/IO and the external activating supply – this is a 1.1V DDR5 component.
• Temperature: §6.3 Table 7 prints two rows – Normal Operating Temperature 0 to 85 (NT) and Extended Operating Temperature 0 to 95 (XT) – so the rated operating ceiling is 95 deg C (site term: 0~95°C). Neither order code carries a temperature letter, so both share this range.
• Package: the ordering table prints 82 FBGA and §2 prints “x4/8-32Banks(8 Bank Groups)”.

How the document layers its temperature figures

§6.3 Table 7 splits the operating range into a Normal row (0 to 85 deg C, symbol NT) and an Extended row (0 to 95 deg C, symbol XT); the acronyms are referred to JESD402-1. We publish the 95 deg C ceiling as the component range and keep both rows quoted rather than collapsing them into a single number. The document also notes the extended-range figure is derated for stacked-die (3DS) packages, a separate condition we do not assert for this monolithic component.

What this code is versus its sibling

This page is the K4RAH046VB-BCQK (4Gx4-wide) member of the family. The other order code in the datasheet shares the same 16 Gb density and the same DDR5-4800 speed bin, and differs in data width and internal organisation; it has its own page. The two are not interchangeable – the width is a real electrical difference, not a cosmetic suffix.

Document status

This datasheet is a released specification: its cover prints “Rev. 1.0, Jul. 2021” and the footer prints Rev. 1.0. We publish the figures as printed in that document.

Lifecycle status

The Lifecycle row above is left blank: the datasheet is a technical specification and prints no product status. Separately, we have not verified a reachable per-code Samsung product page for this order code, and third-party catalogue or distributor listings are not an acceptable on-page source under this site’s rules. So this page makes no Active or End-of-Life claim; the gap is tracked as N269.

What the temperature range does and does not claim

The 0 to 95 deg C figure above is a temperature range the document assigns to the part; it is not a reliability qualification. The datasheet carries no certification standard, no qualification body and no qualification result anywhere in its 73 pages, so this page publishes only the printed operating range and asserts no grade beyond it.

Provenance

Every figure above is taken from Samsung 16Gb DDR5 B-die x4/x8 SDRAM component datasheet **Rev. 1.0, Jul. 2021** (73 pages · md5 bb4d1a02bcbeaae8c56e6fbee0ac3e04 · page footer Rev. 1.0), a channel-local copy. Its PDF /Info carries no aggregator watermark and its revision history is part-number-level, but it is a CONFIDENTIAL-marked manufacturer document with no byte-identical public copy verified, so the manufacturer datasheet button is left unpopulated and we do not host the file.

Who makes it

K4RAH046VB-BCQK is a DDR5 SDRAM component of Samsung Electronics Co., Ltd.