H9HCNNNCPMMLXR-NEE

The H9HCNNNCPMMLXR-NEE is a 32 Gb (x16, 2 Channel) SK hynix mobile DRAM component. Its ordering table row prints LPDDR4X, a DDR4-4266 data-rate bin, in a 200Ball FBGA, with an operating temperature range of -25°C ~ +85°C as printed. The table row for this code is the sole basis of every figure on this page; the sibling code in the same table differs only in its rated temperature range and is published on its own page.

Key figures

• Mode and supply: LPDDR4X, operating voltage column 1.8V/1.1/0.6.
• Density and organisation: 32 Gb (x16, 2 Channel).
• Data rate bin as printed: DDR4-4266.
• Package: 200Ball FBGA, lead- and halogen-free.
• Operating temperature as printed: -25°C ~ +85°C.
• Lifecycle: not published on this page — the source document carries no status statement and we do not infer one.

Ordering-code form

The data sheet prints the decoder line for this family with two wildcard positions after the PMMLXR suffix, and its ordering table lists only the codes reproduced above. Where a supplier-quoted code carries an extra trailing position, that position is a packaging form handled at the spot-listing layer, not a different device.

Provenance

Every figure above is taken from the ordering-information table of SK hynix H9HCNNNCPMMLXR mobile LPDDR data sheet Rev. 1.0, Apr. 2020 (Consumer_H9HCNNNCPMMLXR1.0-LPDDR4X-32Gb_1ynm.pdf · 9,779,856 bytes · md5 03cbbfa82cb9090a97e959874b0523c1 · manufacturer-restricted document), and from the same table row that prints this part number.

Who makes it

SK hynix started its semiconductor business in February 1983 and is headquartered at Icheon-si, Gyeonggi-do, Korea. It is a memory semiconductor maker supplying DRAM and NAND.