HN8T25DEHKX077

The HN8T25DEHKX077 is a 512GB SK hynix UFS 3.1 embedded storage component: 512Gb x8 of NAND flash with an integrated controller, in a 153FBGA package with a 11.0 x 13.0 x 1.0 mm body. Its product line-up row prints capacity, stack, case-temperature range and this part number together, and that single row is the basis of every figure on this page.

Key figures

• Capacity as printed: 512GB.
• NAND stack configuration: 512Gb x8.
• Interface: UFS 3.1, per the data sheet’s own compatibility statement.
• Package as printed: 153FBGA.
• Case operating temperature as printed: -25℃ ~ +85℃.
• Body size as printed: 11.0 x 13.0 x 1.0 mm.
• Lifecycle: not published on this page — the document carries no availability or status statement and we do not infer one.

How the line-up columns read

Package type and, for the middle rows, body size are printed as cells that span the family block rather than repeated per row. We publish them for this part because the spanning cell covers its row, and we say so instead of implying each row reprints them.

Provenance

Every figure above is taken from SK hynix UFS 3.1 3D V7 128GB-1TB data sheet Rev 1.1, Sep. 2021 (manufacturer-restricted document), section 1.2 Product Line-up and section 1.3 Key Features.

Who makes it

SK hynix started its semiconductor business in February 1983 and is headquartered at Icheon-si, Gyeonggi-do, Korea. It is a memory semiconductor maker supplying DRAM and NAND.