HN8T261ZGKX014

The HN8T261ZGKX014 is a 512GB SK hynix embedded storage component: 512Gb x 8 of NAND flash with an integrated controller, in a 153FBGA ball grid array package with a 11.5 x 13.0 x 1.0 mm body. Its product line-up row in the data sheet prints these values together, and that single row is the basis of every figure on this page.

Key figures

• Capacity as printed: 512GB.
• NAND stack configuration: 512Gb x 8.
• Interface: UFS 2.2 — the data sheet states compatibility with the JEDEC UFS 2.2 standard.
• Body size as printed: 11.5 x 13.0 x 1.0 mm.
• Operating temperature as printed: -25°C ~ +85°C.
• Lifecycle: not published on this page — the document carries no availability or status statement and we do not infer one.

How the package column reads

The line-up table carries one merged Package Type cell for the whole family, printed once against its first row. We publish it for this part as 153FBGA because the merged cell spans its row, and we say so rather than implying the cell is repeated per row.

Provenance

Every figure above is taken from SK hynix UFS 2.2 3D V6 data sheet Rev 1.0, Mar. 2020 (manufacturer-restricted document), section 1.2 Product Line-up and section 1.3 Key Features.

Who makes it

SK hynix started its semiconductor business in February 1983 and is headquartered at Icheon-si, Gyeonggi-do, Korea. It is a memory semiconductor maker supplying DRAM and NAND.