TEMCG105T10-A8S5

TEMCG105T10-A8S5 is TWSC’s 64 GB embedded multi-media card (eMMC) device — a NAND flash array with an on-package MMC controller, in a BGA-153 package measuring 11.5 × 13 × 0.8 mm and rated for an operating range of -25°C to 85°C.

Key figures

• Standard: the document states compliance with the eMMC 5.1 standard specification, with backward compatibility to earlier eMMC revisions, and lists the HS400 and HS200 bus speed modes; the §10 order table describes this part as eMMC5.1/HS400.
• Capacity: 64 GB, printed in the cover feature list and in both the §3 product table and the §10 order table.
• Throughput: the performance table gives a sequential read of 320 MB/s and a sequential write of 250 MB/s, measured at 8-bit bus width in HS400 with 512 KB transfers and no filesystem overhead.
• Supply: the §3 product table prints VCC 3.3 V and VCCQ 3.3 V/1.8 V; the feature list gives the controller supply window as 1.70 V to 1.95 V or 2.7 V to 3.6 V.
• Temperature: the feature list prints an operating range of -25°C to 85°C. We tag that printed range and make no further grade claim.
• Package: BGA-153 ball array, 11.5 × 13 × 0.8 mm outline, with an order-information figure drawn for the 153-ball body.

What this document does not say

Three things a buyer might expect are deliberately absent from this profile, because the manufacturer document does not state them. First, the NAND cell type is not given — the document nowhere names QLC, TLC or MLC, so no cell-type claim appears on this page even where reseller material asserts one. Second, no lifecycle, last-time-of-sale or endurance (P/E, TBW) figure is printed, so the lifecycle field is left empty rather than inferred. Third, the document carries no grade statement beyond the printed operating range above, and no endurance (P/E or TBW) figure; such claims require a first-party line or a report number, and neither exists in the document.

The document revision history ends at Ver. 1.1 dated 2025.01, following an initial release 2024.09 stating size information. The profile is built from a channel-local copy of the manufacturer datasheet: no byte-identical manufacturer-hosted public copy has been verified, so the manufacturer datasheet button is left unpopulated and no mirrored file is linked from this page.

Provenance

Every figure above is taken from TWSC eMMC device datasheet Ver. 1.1 (34 pp.; cover, feature list, package outline, product/performance tables and §10 Order Information; channel-local copy of the manufacturer document) whose footers carry the manufacturer copyright line on all 34 pages and whose contact domain is www.twsc.com.cn. The capacity, package and voltage rows come from the cover feature list and the §3 product table; the throughput figures come from the §3 performance table; the bus-mode and standard-revision statements come from the same feature list and the §10 order table; the revision dates come from the Version History block on the first page. Each published value is listed below with the string it was read from.

Who makes it

TWSC is the brand of 深圳市德明利技术股份有限公司 (Shenzhen Techwinsemi Technology Co., Ltd.), which the manufacturer’s own company profile states was founded in 2008 and listed on the Shenzhen main board in 2022 under stock code 001309; that profile lists embedded storage — eMMC, UFS and LPDDR — among its product families, and the footers of this part’s datasheet name the same legal entity. The filing number shown in that site’s footer is treated only as corroboration and is not reproduced here. We publish only what the manufacturer document and the manufacturer profile state.