H5CG54MGBDX051

The H5CG54MGBDX051 is a 32 Gb DDR5 SDRAM component from SK hynix, organized 8Gb x 4 (x4). It belongs to a single SK hynix component datasheet whose ordering table (section 1.1) lists twelve orderable codes spanning the x4, x8 and x16 organizations and four speed grades.

Key figures

• Density 32 Gb (part-number decoder: G5 = 32Gb).
• Organization 8Gb x 4 (x4, decoder position = X4).
• Speed grade G = DDR5-5600, tCK 0.357 ns, CAS latency 16, CL-tRCD-tRP 46-45-45.
• Package 82ball FBGA (serial code 051).
• Temperature code D = CT (0~95°C), a commercial range.

Reading the grade

The G in this code is a speed grade (5600), not a temperature grade. The datasheet carries no reliability-certification or vehicle-grade statement, and none is claimed here. The temperature code D prints a commercial range of 0~95°C.

Known discrepancy in the source document (N264)

We publish density and organization strictly from the section 1.1 ordering table and the part-number decoder (32 Gb, 8Gb x 4). The document body elsewhere carries a leftover description reading “are a 16Gb DDR5 DRAM” and an unrelated “24Gb” reference, contradicting its own cover, ordering table and decoder (all 32Gb). This is an error in the source, not a second capacity; we take the ordering table as authoritative. Tracked as N264.

Full ordering code and packaging suffix

The datasheet ordering table lists this code as H5CG54MGBDX051 (base ordering code, no trailing packaging position). Supplier-reported spot listings may carry a trailing position where N denotes tray packaging and R denotes tape-and-reel; these are packaging suffixes on the same die, handled at the spot-listing layer.

Provenance

Every figure above is taken verbatim from SK hynix DDR5 SDRAM 32Gb M-die component datasheet Rev 1.2（483 页 · md5 30572b7f153df4d1b58effafacc7e7f7 · 修订史末行 1.2 Updated RFM Features Jul. 2025）, from its section 1.1 Ordering Information, section 1.2 Operating Frequency, and the Component Part Number Decoder on the preceding pages.

Who makes it

SK hynix started its semiconductor business in February 1983 and is headquartered at Icheon-si, Gyeonggi-do, Korea. It is a memory semiconductor maker supplying DRAM and NAND.