HSEMSCS2F2B128G

What this part is

HSEMSCS2F2B128G is the 128 GB member of HIKSEMI’s industry-temperature eMMC 5.1 line: 3D TLC, 256 Gb × 4 in a 153-ball FBGA measuring 11.5 × 13 × 1.0 mm, compliant with JEDEC/MMC standard version 5.1 and backward compatible to eMMC v4.5 through v5.1. The document’s running header calls the line “Industry eMMC5.1”; the body itself makes no grade, qualification or certification statement.

Who makes it. HIKSEMI is the storage brand of 杭州海康存储科技有限公司 (Hangzhou HIKStorage Technology Co., Ltd.). The company’s own profile states it was founded in 2017 and builds on the technology base of Hikvision (海康威视) in audio-video, imaging capture and data management, with its timeline putting the engineering team at 2015 and the registered company at 2017. The datasheet behind this page carries that same entity’s copyright line, so brand and document author are one party here.

The same document covers one other capacity in this line — 32 GB — with its own figures; this page carries only the numbers printed for 128GB.

Capacity map as delivered

MemSignal recomputed rather than transcribed: SEC_COUNT 0xE680000 is 241,697,024 sectors of 512 bytes, which is 123,748,745,216 bytes — exactly 118,016 MB. Pre-burned capacity is the data budget available before SMT; anything written ahead of reflow has to stay inside it.

The enhanced-size row in this document does not add up

Table 8 prints the maximum enhanced user area as 0x2668000 — that is a sector-count shape, not a megabyte figure like every other part in this family publishes. Recomputing from the same table’s own constants gives a different answer: the manufacturer’s formula MAX_ENH_SIZE_MULT × HC_WP_GRP_SIZE × HC_ERASE_GRP_SIZE × 512 KB with 0x99A × 0x20 × 0x1 works out to 39,328 MB, while reading the printed 0x2668000 as a sector count yields 19,664 MB — exactly half of the computed value. So the row is wrong in both unit and magnitude, and we cannot tell which one the author intended.

We publish the printed value and this arithmetic note instead of substituting a number. MemSignal’s arithmetic, not a manufacturer statement: treat the enhanced-user-area size of this part as unspecified until the manufacturer corrects Table 8. The user area and SEC_COUNT elsewhere in the same document do reconcile (0xE680000 × 512 bytes is exactly 118,016 MB), so the defect is confined to that one row.

Interface

• Bus width 1-bit (default), 4-bit or 8-bit; Single Data Rate and Dual Data Rate supported.
• Top timing mode HS400, clock 0 to 200 MHz.
• Protocol JEDEC/MMC standard version 5.1; backward compatible to eMMC v4.5 through v5.1.
• Package: 153-ball FBGA, 11.5 × 13 × 1.0 mm.
• Registers as printed by the manufacturer: CID product name SCS2F2, product revision 0x10.

Supply and power

VCC (NAND/core) is 2.7 to 3.6 V, typical 3.3 V. VCCQ (controller/IO) accepts either 1.7 to 1.95 V (typical 1.8 V) or 2.7 to 3.6 V (typical 3.3 V) — the board is designed for one I/O rail or the other, not both at once.

Standby draws 100 µA on VCC and 160 µA on VCCQ; in sleep, VCC drops to 0 µA while VCCQ stays at 160 µA (both with an 8-bit bus and no clock). Maximum RMS current is averaged over a 100 ms window and the manufacturer notes these figures are “not 100% tested”. As with the other HIKSEMI documents we have entered, the timing mode used for Table 11 is not stated, so these currents cannot be compared mode-for-mode against another part’s current table.

Performance figures

Sequential read up to 270 MB/s and write up to 230 MB/s; random read up to 5,000 IOPS and random write up to 2,500 IOPS, all at HS400. The manufacturer’s test conditions are a GL3227 card reader over USB 3.0 on a FAT32 volume, OS-less host, clean state — no CrystalDiskMark version is named in this document. These are component-level vendor figures, not system benchmarks; they will not reproduce on a different host controller, file system or fill state.

Temperature, and what the document does not claim

The manufacturer states an operating temperature range of -40°C to +85°C and the same -40°C to +85°C for storage — the industrial band, which is why we file this part under that grade term rather than the extended/consumer one used elsewhere in this family.

What the document does not contain matters as much. There is no qualification or certification statement of any kind in it, no grade designation in the body (the word “Industry” appears only in the page header naming the product line), no endurance figure (P/E cycles or terabytes written), no reliability or RoHS/moisture-sensitive statement, no lifecycle or end-of-life position, and — unlike HIKSEMI’s consumer parts — no application list at all, so we publish none. Anyone reading this page for an automotive design-in should treat those absences as real: an industrial temperature range is not an automotive qualification.

Device features listed by the manufacturer

From the same document’s feature overview: original and alternative boot modes; hardware reset signal; data removal commands (erase, trim, sanitize, discard); multiple partitioning; signed access to a replay protected memory block (RPMB); lock/unlock and write protection; password, permanent, power-on and temporary data protection mechanisms; sleep and awake modes; and power-off notification. Nothing outside that list is claimed for the device by this document.

Source and status of this document

The underlying document is “HIKSEMI Industry eMMC5.1 HSEMSCS2F2B128G DataSheet. V1.1”, 22 pages; revision history: 1.0 (6 Jul 2021, Preliminary) and 1.1 (12 Dec 2021, described only as “Rev1.1”). It carries the standard “Data subject to change without notice” caveat and a 2020 copyright line for Hangzhou HIKStorage; the page footers point at en.hikstorage.com, the manufacturer’s legacy domain, while its product pages live at hiksemitech.com.

Unlike several other documents in our index, this one is published by the manufacturer itself: the copy supplied to us is byte-for-byte identical to the datasheet offered for download from the manufacturer’s industrial eMMC page (same 32-character MD5, and the same extracted figure set across every specification table), which is why this page links to that document instead of only describing it. The document is still a Preliminary release, so treat the parameters as manufacturer-stated values under a non-frozen specification.

Not yet recorded

Country of origin, lifecycle position, endurance figures and an application list are all absent from the document and stay empty — we do not fill a grade or status from the product line’s marketing name. Cross-referenced alternatives are gated on this page as everywhere else on this site: a substitution row would change what somebody buys, so it needs a source, a date and a named reviewer first.