HSEMTCY2D2B64GG

HSEMTCY2D2B64GG is the 64 GB member of HIKSEMI’s Industry eMMC 5.1 line: a managed NAND device on 3D TLC (256 Gb x 2 stacked) with an embedded controller, in a 153-ball FBGA measuring 11.5 x 13 x 1.0 mm, rated -40°C to +85°C.

Key figures

• User area 59,640 MB; SEC_COUNT in Extended CSD is 0x747C000.
• Sequential read up to 290 MB/s, sequential write up to 200 MB/s.
• Random read 3,500 IOPS, random write 3,200 IOPS.
• Maximum enhanced partition 19,872 MB (MAX_ENH_SIZE_MULT 0x4DA, HC_WP_GRP_SIZE 0x20, HC_ERASE_GRP_SIZE 0x1).
• Pre-burned capacity 19.4 GB, rated for 3 reflow cycles; boot partitions 4,096 KB each.
• Supply VCC 2.7-3.6 V, VCCQ 1.7-1.95 V or 2.7-3.6 V; HS400 with an interface clock of 0-200 MHz.

Which version of the document this page reads

The copy behind this page is datasheet V1.0, whose revision history ends at a single row: 1.0, Jul.6th,2022, Preliminary. The manufacturer’s industrial eMMC page now lists a V1.1 of the same document, and the two are not the same file: every figure on this page matches between them except two. V1.1 prints a maximum enhanced partition of 19,824 MB with MAX_ENH_SIZE_MULT 0x4D7, and a pre-burned capacity of 19.36 GB, where V1.0 prints 19,872 MB / 0x4DA and 19.4 GB. Both are internally consistent – 0x4DA x 0x20 x 0x1 x 512 KB is 19,872 MB and 0x4D7 x 0x20 x 0x1 x 512 KB is 19,824 MB, a difference of 48 MB (three counts of 16 MB) – so this is a changed value, not a typo in one of the two. We publish both and do not choose between them. Note also that the V1.1 file we retrieved still carries the 1.0 row as its only revision entry, so the version difference cannot be confirmed from its own revision table; the evidence is the document title on the manufacturer’s page plus the changed cells. The capacity, SEC_COUNT, performance, package and temperature figures are identical across the two versions.

Grade, and what the document does not claim

The document states an operating range of -40°C to +85°C and the same storage range, and the word describing that class appears in the product name and cover title. It carries no qualification statement, no certification reference, no endurance figure (P/E cycles or terabytes written) and no lifecycle position. An industrial temperature range is not an automotive qualification, and we do not claim one.

Provenance

Every figure above is taken from HIKSEMI Industry eMMC5.1 HSEMTCY2D2B64GG DataSheet V1.0（渠道件 · 22 页 · md5 5e85c77dbee4567e1ebdd2f45ba7eddb · 修订史末行 1.0 Jul.6th,2022 Preliminary）, received through the distribution channel. The manufacturer hosts a different version of this document, so no datasheet link is published here: we only link a datasheet when the file behind the page is byte-for-byte the file the manufacturer serves. The user-area figure 59,640 MB is the document’s own printed value and also what its SEC_COUNT of 0x747C000 multiplies out to, so capacity and register agree on this point in both versions.

Who makes it

HIKSEMI is the storage brand of 杭州海康存储科技有限公司 (Hangzhou HIKStorage Technology Co., Ltd.), founded in 2017 and built on the Hikvision group’s storage team. 杭州海康存储科技有限公司 成立于2017年，依托海康威视的技术积累（其团队 2015年：技术团队成立）。