EC100UFCA064EB

EC100UFCA064EB is the 64 GB member of UFLASH’s EC100 eMMC 5.1 line, filed commercial on the cover and rated -25°C to +85°C, in a 153-ball FBGA measuring 11.5 x 13.0 x 1.0 mm.

Key figures

• Nominal capacity 64 GB; the ordering table prints the user area as 58.24 GB.
• SEC_COUNT in Extended CSD is 0x7480000.
• Sequential read up to 290 MB/s, sequential write up to 270 MB/s.
• Random 4K read 90 MB/s, random 4K write 88 MB/s – printed in MB/s, not IOPS.
• Active current 98 mA on VCC and 125 mA on VCCQ; standby 72 uA / 165 uA; sleep 0 uA / 165 uA.
• Pre-load ceiling before SMT: 19 GB of data written to the fake-SLC area.
• Supply VCC 2.7~3.6 V, VCCQ 1.7~1.95 V or 2.7~3.6 V; HS400 and HS200; interface clock 0~200 MHz.

Capacity: register and table agree here

MemSignal recomputed the register to check the printed user area. SEC_COUNT 0x7480000 is 122,159,104 sectors of 512 bytes, i.e. 62,545,461,248 bytes – 59,648 MiB, which is 58.25 GiB against the printed 58.24 GB. The 0.01 GiB difference is rounding in the document’s own table, not a contradiction, so this page publishes the printed figure with the recomputation shown beside it. That is worth stating explicitly because its sibling 16 GB document does not pass this check.

Where the document and the manufacturer’s series page disagree – in both directions

The datasheet states sequential read up to 290 MB/s and sequential write up to 270 MB/s. The manufacturer’s EC100 series page states, for the 64 GB capacity column of its Commercial table, sequential read up to 320 MB/s and sequential write up to 260 MB/s. So the document is 30 MB/s below the page on reads but 10 MB/s above it on writes. That asymmetry matters: the ordinary explanation – a product page quotes the series best case, a part document quotes the part – would predict the document to sit at or below the page in both columns, and here it does not. Both figures are on the record and we are not choosing between them. Everything structural otherwise matches between the two sources: eMMC 5.1 on JESD84-B51, HS400, a 153-ball FBGA at 13 x 11.5 x 1.0 mm, operating -25°C to +85°C and storage -40°C to +85°C, VCC 2.7~3.6 V with VCCQ 1.7~1.95 V or 2.7~3.6 V.

Performance test conditions

The performance table was measured on an 8-bit bus in HS400 mode at 200 MHz DDR at room temperature, on a test board running Android 15, and the document notes performance may vary with conditions and environment. Random 4K results are printed in MB/s, so this page does not publish an IOPS figure for them.

Temperature, endurance, and what the document does not claim

The document states an operating range of -25°C to +85°C and a storage range of -40°C to +85°C. It carries no qualification or certification statement of any kind, no endurance figure (P/E cycles or terabytes written), no lifecycle position, and no NAND flash type for this part – the series page lists NAND types per capacity column, but mapping a column onto a specific ordering code is not something the documents let us confirm, so we do not publish one. The EC100 line has an industrial variant on the series page with a -40°C operating floor; that variant is a different part number and is not this one.

Source and status of this document

The underlying document is “UFLASH eMMC5.1 EC100 Series Datasheet – Commercial eMMC5.1 EC100UFCA064EB”, 27 pages, version history a single row: 1.0, Initial release, 2026.05 – three months before the 8 GB and 16 GB documents of the same series were cut, which is why this one carries a processing section they do not. It reached us through the supply chain, and no manufacturer-hosted copy was found, so no datasheet link is published. Two provenance weaknesses are worth stating plainly. The file’s own metadata does not match its cover: the PDF title reads “Industrial eMMC Datasheet” and its subject field names a different part (FEMDRM016G-A3A56), while the cover says commercial EC100UFCA064EB. And the CID product name the document prints (1DH1S1, manufacturer ID 85h, revision 01h) does not encode the ordering part number, so the file cannot be self-checked against the part it claims to describe. What we can verify is agreement on every structural field between this document and the manufacturer’s EC100 series page.

Who makes it

UFLASH is the product mark of 紫光闪芯 (Shanxin), which its own company profile describes as the core storage enterprise of the New Unigroup group (新紫光集团); the mainland operating entity is 紫光闪芯科技(成都)有限公司, established February 2024. Its EC100 embedded-eMMC line is documented on the manufacturer’s own site, where it is offered in commercial and industrial temperature variants.