K4U6E3S4AM-TF(H)CL

K4U6E3S4AM is Samsung’s 16 Gb LPDDR4X mobile SDRAM, organised x32 over two 16-bit channels (64M x 16 DQ x 8 banks per channel x 2 channels; 8 Gb per channel x 2 = 16 Gb) on a 200-FBGA 10 × 15 mm package. This datasheet covers the ordering family printed as TF(H)CL, i.e. the two order codes -TFCL and -THCL that differ only in rated temperature. Note for procurement: TF(H)CL is the document’s shorthand, not an orderable part number — bills of material, purchase orders and PCB silkscreen must carry the full order code -TFCL or -THCL.

Key figures

• Density and organisation: 16 Gb, x32 as two x16 channels (2Ch, x16/Ch), array depth 64M x 16 core x 8 banks per channel x 2 channels (per-channel 8 Gb x 2 = 16 Gb), 1st-generation LPDDR4X. The datasheet’s own §2.0 prints this identity as “16Gb = 64M x16DQ x8banks x2channels”; the cover and §5.1 table abbreviate the same per-bank array depth as “64Mb”, which is a manufacturer wording divergence, not a different figure — we print the arithmetic and do not resolve it for Samsung.
• Data rate: up to 4266 Mbps at tCK = 0.468 ns; the document notes 4266 Mbps is backward compatible to lower frequencies.
• Interface and supplies: LVSTLE_06; VDD1 1.8 V, VDD2 1.1 V, VDDQ 0.6 V.
• Package: 200-FBGA, 10 × 15 mm (package code T).

Ordering variants

The §3.0 ordering table prints two order codes that share every characteristic except rated temperature, and this page documents both:

• K4U6E3S4AM-TFCL — temperature/power code F, rated -40°C to +95°C, 4266 Mbps.
• K4U6E3S4AM-THCL — temperature/power code H, rated -40°C to +105°C, 4266 Mbps.

The “TF(H)CL” marking is the document’s own shorthand for this F/H pair; the two ranges are not interchangeable, so select by the printed suffix. Nothing else differs between the two codes per the table.

Lifecycle status

The Lifecycle row above is left blank: the datasheet (Rev. 1.4, Jun. 2021) is a technical specification and states no product status. Separately from that document, Samsung’s product-status pages list both order codes as EOL, and trade reporting first carried by The Elec (2026-04-17) records Samsung ceasing to take new orders across the LPDDR4/LPDDR4X family. That is our distribution desk’s read as of 2026-10-16, not a figure printed in this datasheet, so it is disclosed here as a dated external status and the Lifecycle taxonomy term is deliberately not populated until a manufacturer EOL/PCN notice is obtained (tracked as N89).

What this document says about grade

The §3.0 decode strip prints the temperature/power letter only as an operating range (F = -40°C to +95°C, H = -40°C to +105°C); the datasheet carries no reliability-qualification standard, no grade statement, and no certification body or qualification result anywhere. We publish only those printed operating ranges and assert no grade qualification. Every page carries a Samsung CONFIDENTIAL marking, and the copy additionally carries a third-party reseller contact line on §3.0 that is not part of a Samsung public release — it is a channel-flow trace, which we note rather than treat as manufacturer provenance. This profile publishes only the derived parameters above with per-figure provenance and does not host the file. This contradiction is tracked as N87.

Provenance

Every figure above is taken from Samsung LPDDR4X SDRAM Datasheet Rev. 1.4, Jun. 2021（108 页 · K4U6E3S4AM-TFCL / -THCL · CONFIDENTIAL · p9 含渠道经销商行）, a channel-local copy whose PDF /Info identifies a Samsung-internal FrameMaker/Acrobat-Distiller production file with no aggregator watermark. No byte-identical manufacturer-hosted public copy has been verified, so the manufacturer datasheet button is left unpopulated.

Who makes it

K4U6E3S4AM is an LPDDR4X mobile SDRAM of Samsung Electronics Co., Ltd.