BWMYAX32P8A-32G

BWMYAX32P8A-32G is BIWIN’s 32Gb LPDDR5/5X mobile-DRAM package: two 16 Gb per die (1Gigx32 across a 2 channel x16 configuration, “2 die” in package), binned at 7500 Mb/s per pin in a 315-ball FBGA of 12.4 mm × 15 mm.

Key figures

• Organization: the array prints as 1Gigx32 (1Gx16x2Ch) — one x16 channel per die; the addressing table gives 17,179,869,184 bits for the 16 Gb die (each die holds 1 Gbit x 16).
• Data rate: 7500 Mb/s per pin, 15 GB/s maximum bandwidth per channel, WCK:CK = 4:1.
• Modes: 4KB page size with 8-bank (8B) mode, 2KB page size in bank-group and 16-bank modes; optional link ECC.
• Supplies: VDD1 1.8 V (1.70–1.95 V); VDD2H 1.05 V (1.01–1.12 V); VDD2L 0.9 V (0.87–0.97 V); VDDQ 0.5 V (0.3 V with ODT off).
• Package: 315-ball FBGA (Table 1 prints the package as FBGA315), 12.4 mm × 15 mm outline, 1.0 mm seated height maximum.
• Operating temperature: -25°C to +85°C (feature list and the Tc condition of the IDD tables).
• Refresh (16 Gb die): tRFCab 280 ns all-bank; tRFCpb 140 ns per-bank.
• Identity: MR5 Manufacturer ID 11111111b; MR6 Revision ID 00001000b.

Ordering and decoding

One ordering code is defined by this document. The Part Number Chart decodes BWMYAX32P8A-32G as BW · M · YA · X32 = 32 Bits · P · 8A = 315 Ball · 32G, with the size field printing 12.4*15mm; the package marking carries the same code as the “Sales Item P/N” row. Procurement note: bills of material and purchase orders should carry BWMYAX32P8A-32G verbatim — the shorter field strings in the chart are decoding steps, not orderable codes.

Temperature rating

The datasheet prints -25°C to +85°C as the operating temperature and we tag the part Extended on that basis alone. The document carries no reliability-qualification standard or grade certification of any kind, so this page asserts none — the range is published as printed, nothing more.

Lifecycle status

The Lifecycle row above is left blank: this document is a technical specification and states no product-status or end-of-life figure, so we publish none.

Provenance

Every figure above is taken from the 21-page manufacturer datasheet, document code DAT-CES-0267-B, release stamp 2025.01.13, revision history ending at Rev 1.0 dated 2024.10 — a channel-local copy: its PDF properties name an individual author and a third-party word processor as the producing tools, and every page carries a BIWIN confidentiality header. Because no byte-identical manufacturer-hosted public copy has been verified, the manufacturer datasheet button is left unpopulated and the file is not hosted or reproduced here. The manufacturer’s public LPDDR5X product page confirms the family at the same package line (315-ball) and voltage set; this ordering code itself is not itemised on that page, which we continue to track as an open sourcing question.

Who makes it

BIWIN Storage Technology Co., Ltd. (深圳佰维存储科技股份有限公司), headquartered in Shenzhen, was founded 2010 and lists on the SSE STAR Market under code 688525. Its own company profile describes an integrated research, design, packaging and testing model for semiconductor storage.