HSEMTDY6S2D032B

What this part is

HSEMTDY6S2D032B is HIKSEMI’s 32 GB automotive-temperature eMMC 5.1 device: one 3D MLC package (342 Gb x 1) with an embedded controller, JEDEC MMC 5.1 compliant and backward compatible from eMMC 4.5 through 5.1. A 40 GB variant is offered as a customization of the same package. MemSignal compiled this page from the manufacturer’s own document and product listing; the datasheet itself is linked, not hosted.

Who makes it. HIKSEMI is the storage brand of 杭州海康存储科技有限公司 (Hangzhou HIKStorage Technology Co., Ltd.). The company’s own profile states it was founded in 2017 and builds on the technology base of Hikvision (海康威视) in audio-video, imaging capture and data management, with its timeline putting the engineering team at 2015 and the registered company at 2017. The datasheet behind this page carries that same entity’s copyright line, so brand and document author are one party here.

Capacity map as delivered

The device ships with the user data area, two boot area partitions and an RPMB partition. Boot and RPMB sizes are fixed; the user area is what a firmware image actually sees.

Pre-burned capacity is the data budget available before SMT; the manufacturer’s guidance is that anything written to the device before reflow must stay inside it.

Interface

• Bus width 1-bit (default), 4-bit or 8-bit; SDR and DDR supported.
• Top timing mode HS400, clock 0 to 200 MHz.
• Protocol JEDEC MMC 5.1; the device is backward compatible to eMMC 4.5 through 5.1.
• Package: 153-pin fine-pitch BGA, 11.5 × 13.0 × 1.2 mm max.

Supply and power

VCC (NAND/core) is 2.7 to 3.6 V, typical 3.3 V. VCCQ (controller/IO) accepts either 1.7 to 1.95 V (typical 1.8 V) or 2.7 to 3.6 V (typical 3.3 V), so the page needs to be designed for one of the two I/O rails, not both at once.

Standby draws 65 µA on VCC and 220 µA on VCCQ; in sleep state VCC drops to 0 µA while VCCQ stays at 220 µA (x8 bus, no clock). Max RMS current is averaged over a 100 ms window, and the manufacturer notes these figures are not 100% tested.

Performance figures

All four numbers below carry the manufacturer’s own test conditions: GL3227 card reader, USB 3.0, FAT32 file system, OS-less host, clean state. They are not system-level benchmarks and will not reproduce on a different host controller or file system.

Device features listed by the manufacturer

• Original and alternative boot modes; hardware reset signal; sleep/awake; power-off notification; background operations with HPI.
• Multiple partitioning, RPMB, lock/unlock and write protection, force erase, and password / permanent / power-on / temporary data protection mechanisms.
• Data removal commands: erase, trim, sanitize, discard. Enhanced reliable write.
• S.M.A.R.T. health report, field firmware update (FFU), production state awareness.

Qualification and environment claims, kept separate

Two different manufacturer documents make two different kinds of claim, so they are recorded apart. Operating temperature appears in the datasheet: both operating and storage range are -40°C to +105°C. Automotive qualification appears on the manufacturer’s product page, which states the series is “certified for AEC-Q100 and IATF 16949” for 24/7 operation in harsh conditions; the datasheet text itself does not repeat that certification. Note also that IATF 16949 is a quality-management certification of a manufacturing site, not a part-level qualification like AEC-Q100, so the two should not be read as one part-level certificate.

Revision status of the source document

The public datasheet’s revision history shows 1.0 (17 Nov 2023, Preliminary) and 1.1 (10 Jan 2024, “Add 40GB eMMC feature”); the copyright line reads “2022 HANGZHOU HIKSTORAGE TECHNOLOGY CO., LTD”. A channel-supplied copy dated 23 Jan 2024 carries a single revision row marked “V1.0.0 Preview edition” and a 2024 copyright line, while its file name says V1.0.1. Both documents state that data is subject to change without notice, and neither is marked as a final production release. MemSignal therefore publishes these parameters as manufacturer-stated values under a preliminary document status, not as a frozen specification. If a design-in decision depends on an exact figure, request the current release from the manufacturer through your own contact rather than relying on this page.

Not yet recorded

Three fields the data model supports stay empty because no manufacturer-published source states them: typical applications, lifecycle status, and country of origin. Cross-referenced alternatives are gated below on this page for the same reason: a substitution row would change what somebody buys, so it needs a source, a date and a named reviewer first.