HSEL4XSA2G-HD8

HSEL4XSA2G-HD8 is a 2 GB LPDDR4X SDRAM: 16 Gb of core organised x16 across two channels, a 3733 data rate, in a 200-ball FBGA measuring 10 x 15 mm on a 0.8 x 0.65 mm pitch, with an operating temperature range of -25°C to +85°C.

Key figures

• Density 16 Gb per device, which the document itself expands to 17,179,869,184 bits – divided by eight that is 2,147,483,648 bytes, the 2 GB on the cover exactly.
• Organisation x16, 2 channel.
• Data rate column reads 3733.
• Supply: VDD1 1.8 V typical over a 1.70-1.95 V range, VDD2 1.1 V typical over 1.06-1.17 V, VDDQ 0.6 V typical over 0.57-0.65 V.
• Package 200-ball FBGA, 10 x 15 mm, 0.8 x 0.65 mm pitch, lead and halogen free.
• Operating temperature -25°C to +85°C.

Two things the document says awkwardly, printed as it says them

The Speed column of the ordering table reads “DDR4 3733” in a document whose cover and introduction both say LPDDR4X. We have kept the printed wording rather than quietly correcting it to LPDDR4, because we cannot tell from the document whether that is a stray label or a deliberate reference to the DDR4 data-rate class the interface runs at. Treat the 3733 as the usable figure and the “DDR4” prefix as unresolved.

The second point is about this page, not the part. Our copy has no revision-history table anywhere in its 183 pages, so the V2.0 in the file name is the only place that version number appears. We therefore publish no version claim on this page: a version we cannot read out of the document is not something we will assert.

How this code relates to the six HSEL4X parts already in the library

The 2 GB and 4 GB LPDDR4X family document covers six ordering codes – HSEL4XDA2G-CA7M, HSEL4XDA2G-CA8M and HSEL4XDA2G-CA9M at 2 GB, and HSEL4XFA4G-CA7M, HSEL4XFA4G-CA8M and HSEL4XFA4G-CA9M at 4 GB – and HSEL4XSA2G-HD8 is not one of them. So this is a separate ordering code, not a relabelling of an existing row. Two of its figures do coincide with that table: it is also 2 GB and it is also 3733, which is the same point the CA8M codes make. Two things genuinely differ. The family table gives the package as 200 Ball Discrete, while this document’s own ordering table says 200Ball FBGA and its mechanical section gives the 10 x 15 mm outline and the 0.8 x 0.65 mm pitch; we file this part under FBGA because that is what its own document prints, and the two wordings for what may well be the same package are left visible rather than harmonised. And the family document states no supply ranges in its ordering table, while this one carries full min / typ / max DC operating conditions.

What the document does not claim

No qualification or certification statement, no endurance figure, and no lifecycle position. The -25°C to +85°C range is printed in the ordering table under Operating Temperature; it is not, on its own, an industrial rating, and we do not describe it as one.

Provenance

Figures are taken from HIKSEMI LPDDR4x HSEL4XSA2G-HD8 DataSheet V2.0（渠道件 · 183 页 · md5 7329504e0d3a98cf50f6ec9a77a36957 · 内文无修订史表，版本号只见于文件名）, received through the distribution channel. No manufacturer-hosted copy of this file was found, so the datasheet link is left blank rather than pointing at a same-family page.

Who makes it

HIKSEMI is the storage brand of 杭州海康存储科技有限公司 (Hangzhou HIKStorage Technology Co., Ltd.), founded in 2017 and built on the Hikvision group’s storage team. 杭州海康存储科技有限公司 成立于2017年，依托海康威视的技术积累（其团队 2015年：技术团队成立）。