K4UBE3D4AA-MGCL

K4UBE3D4AA-MGCL is Samsung’s 32Gb DDP (dual-die package) LPDDR4X mobile SDRAM of the 2nd generation. The datasheet describes a 2 channel composition per die, each channel x16 / channel with 8 banks per channel; the §2.0 key-feature line prints the array identity as “32G DDP = 64M x32DQ x8banks x2channels”, which the cover abbreviates as 64Mb x32DQ (same array). It is binned up to 4266 Mbps (tCK = 0.468 ns), with the §3.0 notes stating that 4266 Mbps is backward compatible to 3733 Mbps and that 3733 Mbps in turn is backward compatible to 3200 Mbps. Procurement note: the full order code on the §3.0 ordering table is K4UBE3D4AA-MGCL — bills of material, purchase orders and silkscreen should carry that code.

Key figures

• Density and organisation: 32Gb DDP across two channels; §2.0 prints “32G DDP = 64M x32DQ x8banks x2channels” (cover shorthand 64Mb x32DQ is the same array).
• Data rate: up to 4266 Mbps at tCK = 0.468 ns; bin notes step down through 3733 Mbps to 3200 Mbps.
• Supplies and IO: interface LVSTLE_06 with VDD1/VDD2/VDDQ = 1.8V / 1.1V / 0.6V.
• Package: 200-ball FBGA (10 x 15 mm) — order-table package code M, printed as 200-FBGA, 10×15.
• Refresh: the §2.0 feature list prints refresh 3.9 µs.

Ordering and decoding

§3.0 prints exactly one order code for this document. Its decode strip reads: U = LPDDR4X SDRAM, BE = 32G with 8K/32ms refresh, 3D = x32 (DDP LPDDR4X), 4 = 8Bank, A = LVSTLE_06 at 1.8V/1.1V/0.6V, and the letter pair AA ending the code marks this device as 2nd Generation (the later AB device of the same family is 3rd Generation and is documented on its own page).

Temperature rating

The §3.0 order table rates the case temperature as Tc = -25 to +85 °C, and §8.4 Table 20 lists the same range under the printed heading Standard. The datasheet carries no reliability qualification standard and no grade certification of any kind, so this page asserts none — the temperature range is published as printed, nothing more.

Lifecycle status

The Lifecycle row above is left blank: this document is a technical specification and states no product-status or end-of-life figure, so we publish none.

Provenance

Every figure above is taken from Samsung 32Gb DDP LPDDR4X SDRAM Datasheet Rev. 1.0 (Final, Oct. 2018) — K4UBE3D4AA-MGCL（107 页 · 本地渠道件：FrameMaker 原厂排版、Producer 显示 iText 重存、逐页叠印第三方联系人邮箱水印） — the PDF identifies a Samsung FrameMaker production document, but its Producer line shows an iText re-save, every page carries a third party’s contact-line e-mail watermark added after distribution (a channel-flow trace, which we note rather than treat as manufacturer provenance, and whose address we do not print), and the cover text includes Samsung’s confidentiality notice. This profile therefore publishes only the derived parameters above with per-figure provenance, does not host or reproduce the file, and leaves the manufacturer datasheet button unpopulated: no byte-identical manufacturer-hosted public copy has been verified. The document is dated Rev. 1.0 (Final, Oct. 2018) with its revision history ending at that line.

Who makes it

K4UBE3D4AA-MGCL is a 32Gb DDP LPDDR4X mobile SDRAM of Samsung Electronics Co., Ltd.