K4UBE3D4AB-MGCL

K4UBE3D4AB-MGCL is Samsung’s 32Gb DDP (dual-die package) LPDDR4X mobile SDRAM. The datasheet describes a 2 channel composition per die, each channel x16 / channel with 8 banks per channel; the §2.0 key-feature line prints the array identity as “32Gb DDP = 128M x16DQ x8banks x2channels”, which the cover abbreviates as 128Mb x16DQ (same array). It is binned up to 4266 Mbps (tCK = 0.468 ns); the §3.0 note adds that 4266 Mbps is backward compatible to lower frequencies. Procurement note: the full order code on the §3.0 ordering table is K4UBE3D4AB-MGCL — bills of material, purchase orders and silkscreen should carry that code.

Key figures

• Density and organisation: 32Gb DDP across two channels; §2.0 prints “32Gb DDP = 128M x16DQ x8banks x2channels” (cover shorthand 128Mb x16DQ is the same array).
• Data rate: up to 4266 Mbps at tCK = 0.468 ns (backward compatible to lower frequencies).
• Supplies and IO: interface LVSTLE_06 with VDD1/VDD2/VDDQ = 1.8V / 1.1V / 0.6V.
• Package: 200-ball FBGA (10 x 15 mm) — order-table package code M, printed as 200-FBGA, 10×15.
• Refresh: the §2.0 feature list prints refresh 3.9 µs.

Ordering and decoding

§3.0 prints exactly one order code for this document. Its decode strip reads: U = LPDDR4X SDRAM, BE = 32G with 8K/32ms refresh, 3D = x32 (DDP LPDDR4X), 4 = 8Bank, A = LVSTLE_06 at 1.8V/1.1V/0.6V, and the letter pair AB ending the code marks this device as 3rd Generation (the sister device AA of the same family is 2nd Generation and is documented on its own page).

Temperature rating

The §3.0 order table rates the case temperature as Tc = -25 to +85 °C, and §8.4 Table 20 lists the same range under the printed heading Standard; refresh derating notes apply within it. The datasheet carries no reliability qualification standard and no grade certification of any kind, so this page asserts none — the temperature range is published as printed, nothing more.

Lifecycle status

The Lifecycle row above is left blank: this document is a technical specification and states no product-status or end-of-life figure, so we publish none.

Provenance

Every figure above is taken from Samsung 32Gb DDP LPDDR4X SDRAM Datasheet Rev. 1.0 (Final, Aug. 2021) — K4UBE3D4AB-MGCL（108 页 · 本地渠道件：FrameMaker 原厂排版、Producer 显示 3-Heights PDF Security 加安全层重存） — the PDF /Info identifies a Samsung FrameMaker production file (title K4UBE3D4AB-MGCL_200F_10x15_R10.book, a Samsung-internal author) but the Producer line shows a 3-Heights PDF Security re-save applied after publication, so the copy is not an untouched manufacturer-hosted original; no byte-identical public copy has been verified and the manufacturer datasheet button is left unpopulated. The document is dated Rev. 1.0 (Final, Aug. 2021) with its revision history ending at that line.

Who makes it

K4UBE3D4AB-MGCL is a 32Gb DDP LPDDR4X mobile SDRAM of Samsung Electronics Co., Ltd.