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HIKSEMI

Last updated October 14, 2026 · 16 parts listed

DRAM HSED4HB04G-JD3 FBGA · 0~95°C — Specification →

eMMC HSEMSCS2F2B128G FBGA · Industrial (-40~85°C) — Specification →

eMMC HSEMSDS7S2B64G FBGA · Extended (-25~85°C) — Specification →

eMMC HSEMSDY9S2B64G FBGA · Extended (-25~85°C) Active Specification →

eMMC HSEMSES2S2B16G FBGA · Extended (-25~85°C) — Specification →

eMMC HSEMTCY2D2B64GG FBGA · Industrial (-40~85°C) — Specification →

eMMC HSEMTCY2S2B32GG FBGA · Industrial (-40~85°C) — Specification →

eMMC HSEMTDY6S2D032B FBGA · Automotive (AEC-Q100) — Specification →

LPDDR HSEL4XDA2G-CA7M 200 Ball Discrete · Extended (-25~85°C) — Specification →

LPDDR HSEL4XDA2G-CA8M 200 Ball Discrete · Extended (-25~85°C) — Specification →

LPDDR HSEL4XDA2G-CA9M 200 Ball Discrete · Extended (-25~85°C) — Specification →

LPDDR HSEL4XFA4G-CA7M 200 Ball Discrete · Extended (-25~85°C) — Specification →

LPDDR HSEL4XFA4G-CA8M 200 Ball Discrete · Extended (-25~85°C) — Specification →

LPDDR HSEL4XFA4G-CA9M 200 Ball Discrete · Extended (-25~85°C) — Specification →

LPDDR HSEL4XSA2G-HD8 FBGA · Extended (-25~85°C) — Specification →

NAND Flash HSESDFDSW4G WSON8 · Industrial (-40~85°C) — Specification →

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